“Rather serious cooling issues” is an accurate characterization, but current electronic packaging technology does very little with direct liquid cooling—there’s room to take the heat out if we can crack the theoretical challenges. You would only need to boil a few grams of liquid per second to take off kilowatts of power.
I recall hearing that 3D chips would have some rather serious cooling issues but I suppose that isn’t an obviously unsolvable problem.
“Rather serious cooling issues” is an accurate characterization, but current electronic packaging technology does very little with direct liquid cooling—there’s room to take the heat out if we can crack the theoretical challenges. You would only need to boil a few grams of liquid per second to take off kilowatts of power.